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Qualcomm Announces On-Time Sampling of World’s First Zero IF 3G CDMA2000 1X Chipset and System Software

date: April 15, 2002

Qualcomm today announced the on-time sample shipment of the world’s first Zero Intermediate Frequency (Zero IF) radioOne MSM6050 chipset solution 3G CDMA2000 1X mobile devices. Leveraging the advantages of Zero IF, which include reductions in cost, component count and Printed Circuit Board area (PCB), the samples of the complete system solution consist of the MSM6050 Mobile Station Modem (MSM) chipset and system software, RFT6100, RFR6000 and RFL6000 transmit and receive chips, PM6050 power management chip, and the accompanying Subscriber Unit Reference (SURF) development platform. The radioOne MSM6050 chipset delivers a cost-effective solution for next-generation devices designed to take advantage of the worldwide growth and success of 3G CDMA2000 1X networks and address the growing demand for position location capabilities, and data applications and services.

Qualcomm’s radioOne ZIF architecture eliminates the need for all IF components -IF integrated circuits (ICs), IF Surface Acoustic Wave (SAW) filters, voltage controlled oscillators (VCOs), and Phase Lock Loops (PLLs) - thereby reducing PCB area and Bill of Materials (BOM) for future wireless handsets and other devices. In addition, only one external ultra high frequency (UHF) single-band VCO is required for all CDMA frequency bands worldwide.

"Qualcomm is now delivering its next-generation of 3G mobile device capabilities to CDMA2000 1X terminal manufacturers," said Don Schrock, president of Qualcomm CDMA Technologies. "With the on-time delivery of the MSM6050 radioOne-based chipset, Qualcomm is addressing the market’s demand for new 3G services based on position location and multimedia by providing a flexible and cost-optimized terminal design that can be customized for multiple market segments."

 


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