Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

ADI to showcase TD-SCDMA chipset at 3G summit

April 25, 2005

Analog Devices announced details of its participation as a silver sponsor of the International TD-SCDMA Summit being held at the Kempinski Hotel in Beijing, China on April 26 and 27. The TD-SCDMA Summit brings together key players in the wireless industry to discuss the development and deployment of TD-SCDMA technology, one of the three 3G wireless technologies.

The cornerstone of ADI's participation at the show will be a technical presentation on Wednesday, April 27 from 15.40-16.00 by Dr. Finbarr Moynihan of the RF and wireless systems group at Analog Devices. Dr. Moynihan will discuss technical details of ADI's SoftFone-LCR chipset, a flexible, highly integrated solution for developers of 3G mobile terminals based on the TD-SCDMA Low Chip Rate (LCR) air interface. Powered by ADI's Blackfin Processor, the SoftFone-LCR chipset provides all the critical functions necessary to build a TD-SCDMA handset, including the baseband signal processing and control, analog-interface functions and radio.

"This year is shaping up to be a watershed year for 3G technology development in China, especially with regard to the TD-SCDMA standard," said Christian Kermarrec, vice president, RF and wireless systems, Analog Devices, Inc. "Lack of available chipsets is no longer an issue as TD-SCDMA design starts are up, driven by solutions like our SoftFone-LCR."

ADI, a senior member of the TD-SCDMA Forum, is working closely with Datang Mobile to make 3G wireless a reality in China. Datang Mobile provides the terminal protocol stack software, MeCo, for ADI's SoftFone-LCR chipset, and Datang has been using ADI's Blackfin Processor in development platforms to provide the world's first TD-SCDMA mobile terminal and the first TD-SCDMA PCMCIA data card to achieve TD-SCDMA MTNet test.

About the SoftFone-LCR Chipset

Analog Devices' SoftFone-LCR chipset is based on the popular RAM-based SoftFone architecture used in Analog Devices' GSM/GPRS, EDGE, and W-CDMA chipsets. The chipset incorporates a digital baseband processor, which is based on Analog Devices' successful Blackfin Processor, achieving more than 250 MHz performance and exceptionally low power consumption through Blackfin's Dynamic Power Management capability. The SoftFone-LCR's baseband signal processing, including joint detection and decoding, is performed entirely in software running on the embedded Blackfin Processor core instead of a hardware implementation. This allows terminal developers to quickly and easily adapt to any changes necessary as the initial TD-SCDMA networks rollout.

The SoftFone-LCR's analog baseband and power management IC provides a full set of audio features, as well as efficient power management. The SoftFone-LCR chipset also includes the Othello®-W direct-conversion radio transceiver, offering solid performance and flexibility for either LCR time division duplex (TDD) or W-CDMA frequency division duplex (FDD) terminals. Additionally, the SoftFone-LCR chipset includes interfaces for cameras, color displays, IR, USB and SD/MMC, allowing handset manufacturers to create several designs with varying levels of feature sets for a wide range of phone models. Analog Devices is unique among chipset suppliers of TD-SCDMA solutions in offering a complete baseband and RF chipset solution, which enables complete signal chain optimization and highly integrated and cost effective solutions.