| |
Novatel announces additional OEM design win
April 4, 2006
Novatel Wireless announced that it continues to lead the OEM market for next-generation 3G wireless technology, with the notification of an additional OEM design win for its HSDPA technology and the current initial availability of its embedded technology through one of the world's leading laptop manufacturers. Currently, the company is working with a total of nine mobile computing platform providers who are bringing to market wirelessly-enabled devices based on the company's PCI Express Mini Card products.
"Last week was another important milestone for Novatel Wireless, with another design win and the first initial availability of our embedded wireless solutions through one of the world's premier laptop manufacturers," stated Peter Leparulo, chief executive officer at Novatel Wireless. "According to In-Stat/MDR, laptop manufacturers are projected to ship over three million laptops with embedded wireless modems by the end of 2007…While we have recently started shipping our first OEM products in limited quantities, the real impact of our investments won't be felt until the second half of the year, as we roll into volume with our initial partner and make our first shipments to other Tier-1 OEM partners."
"The company is now in various stages of commercializing our OEM technology into a total of 20 different laptop models, most of which are currently scheduled for final certifications and wide commercial launches beginning in the second half of 2006 and continuing through the beginning of 2007," stated Dr. Slim Souissi, chief technology officer and vice president of research and development at Novatel Wireless. "Our research and development team is commercializing multiple technologies across many of these laptop models, bringing the total to 35 different wireless laptop configurations that Novatel Wireless currently has in various stages of development, integration and certification with our OEM partners and at leading carriers worldwide."
The Company's design wins include several generations of both HSDPA and EV-DO standards, including HSDPA 1.8 Mbps, HSDPA 3.6 Mbps, EV-DO Phase 0 and EV-DO Rev A technologies.
"Our ability to win business on next-generation HSDPA and EV-DO technologies points to our distinct competitive advantages and strategy for leading the OEM market," added Mr. Leparulo. "Over two years ago, we focused the Company on offering both UMTS/HSDPA and EV-DO based technologies and building proven relationships with leading operators in Europe and the United States. We expected that Tier-1 OEMs planning worldwide launches would select a technology partner who had not only development expertise in both UMTS/HSDPA and EV-DO standards, but also experience in certifying and supporting both North American and European operators. In PC Cards, we have certified UMTS/HSDPA technologies at approximately 24 operators worldwide, mostly in Europe and North America, and in EV-DO we believe we have the dominant market share at North American operators."
|
