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Mobilepro Signs MOU with South Korea's Information and Communications University for Co-Development Of Semiconductor Chipsdate: August 7, 2002 Mobilepro, with its subsidiary, Neoreach, a developer of semiconductor chips for 3G wireless communication services, announced that it has signed a Memorandum of Understanding (MOU) with the RF Microelectronics Lab (RFIC) at the Information and Communications University in South Korea to co-develop a new semiconductor chip. Under the MOU, engineering teams from Neoreach and RFIC will devote joint research and design expertise, staffing, facilities resources, project management, and testing for the development of an RF CMOS -- a radio frequency chipset. This specific chipset, which will support the W-CDMA standard, is also a required component in the consumer handsets and base stations managed by the mobile operators to support 3G wireless services. The two organizations will also adapt the chipset, when completed, for use in the Pico Cell Node-B -- a small base station used in high density areas. This co-development initiative has the potential to expand the Neoreach product suite beyond the Company's modem solutions currently in development and testing. The 3G wireless services are rapidly gaining acceptance in South Korea. One of the country's three mobile operators, KT Freetel, launched 3G capability in May and projects its subscriber base for these high-speed services to reach 6.1 million users by year-end.
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