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Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

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Cadence partners with vendors to provide verification system for 2.5/3G and 802.11

December 9, 2002

Cadence Design Systems, supplier of electronic design products and services, today announced that the Cadence Palladium design verification system now has custom interfaces to leading wireless test equipment from Anritsu Corporation, Rohde & Schwarz, and Elektrobit. These companies supply test equipment used by virtually all wireless integrated circuit and systems companies. Interfacing to wireless testers, combined with Palladium's hardware/software co-verification capability, provides complete system-level verification for the latest 2.5G and 3G handset and base station development, and LAN 802.11 wireless applications.

These new interfaces enable designers to verify and stress test their emulated design with real-world stimulus generated by wireless testers -- a system-level verification task otherwise performed after silicon samples have been produced. These powerful environments help wireless companies bridge the gap between simulation and post-silicon debug and find and fix more bugs earlier in the design process, while also concurrently verifying their software drivers and lower-layer protocol stack at emulation speeds. Overall, these capabilities help reduce design cycle times and the risk of costly silicon respins.

LG Electronics is using Palladium for complete system-level verification of its multimillion-gate, 3G WCDMA base station modem chip. "Using Palladium with various wireless test equipment and software debuggers allows us to do hardware and software testing with real-world channel effects, on our six-million-gate, digital base station chip months before getting silicon samples," said Dr. Chul-Heum Yon, vice president of UMTS System Research Lab, LGE.

"We were able to connect third-party software debuggers to the various processors and run software code 10,000 times faster than simulation. We were also able to save valuable time by quickly finding and fixing bugs in the Palladium environment because of its fast compile time -- 12 minutes, from RTL to run-time, on one workstation."

 


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