Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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CAMD introduce EMI filtering and ESD protection for 3G device
December 11, 2002
California Micro Devices today announced two new application specific
integrated passive (ASIP) devices integrating highly effective electromagnetic
interference (EMI) filtering and robust electrostatic discharge
(ESD) protection to support microphone and speaker applications
for wireless 3G handsets and PDAs. These two chips, offered in minimum
form factor Chip Scale Package (CSP) format, expand California Micro
Devices' product family of CSP filtering and ESD solutions for the
wireless handset and PDA marketplace.
The CSPEMI204 addresses the growing low-cost architecture segment
of the wireless handset market where single channel audio ports
are a key feature. The device provides EMI filtering with ESD protection
for both a single channel microphone port and a single channel speaker
port within a single CSP device. The CSPEMI205 provides a single
chip CSP solution for EMI filtering and ESD protection for wireless
handset designs implementing a single channel microphone port and
a dual channel speaker port in support of stereo audio applications.
Emerging 3G cell phones will feature stereo speakers for a richer
audio experience, which makes the CSPEMI205 an ideal solution for
the audio headset port.
The high level of integration and the utilization of the CSP format
for these new devices, allow OEM customers to significantly reduce
board space requirements by 86% versus similar discrete solutions.
In addition to solution form factor reduction, OEMs benefit from
the use of these highly integrated ASIPs through the reduction of
bill-of-material costs as well as procurement and manufacturing
overhead costs associated with procuring manufacturing with a large
number of discrete passive devices.
"With the transition to 2.5G and 3G handset architectures, the
number of discrete passive components utilized on these platforms
has grown," said Shawn Woods, senior analyst at iSuppli Corporation,
a leading market research firm covering the passives and wireless
handset market segments. He continued, "The growth rate of discrete
passive components has slowed, however, partially as a result of
new integrated devices. These devices not only free up valuable
board space, but can also provide performance enhancements to the
circuit."
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3G Motorola A920
