Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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NEC selects TI's newest DSP processor for multimedia-rich 3G networks
December 4, 2006
NEC Corporation has chosen Texas Instruments' (TI) DSP products for its line of WCDMA macro base stations. TI will provide its new single-chip multi-core 3 GHz TMS320TCI6487 programmable digital signal processor (DSP) to achieve higher performance and improved system efficiency, as well as a reduced footprint in their base stations. By using TI's products and technology, NEC will enable operators in Europe and Japan to dramatically reduce the time and effort required to deploy mobile multimedia services today and in the future.
"Texas Instruments' wireless infrastructure products will improve our overall system efficiency by providing greater channel density and increased system flexibility," said Dr. Nobuhiro Endo, Associate Senior Vice President of NEC and the head of Mobile Network Operations Unit. "The programmability and code compatibility of TI's DSP will enable us to gain leadership in WCDMA implementations. In addition, their tools and support enable our system designers to develop products quickly with few challenges. We have a high degree of confidence in our relationship with TI and look forward to continued success in deploying our products in the growing 3G market."
"Texas Instruments and NEC have enjoyed a long, fruitful relationship," said Greg Delagi, vice president of TI's DSP business. "As consumers demand more data and multimedia applications from their handsets, we believe that wireless infrastructure manufacturers will continue to benefit from high performance, programmable solutions that enable them to quickly deploy new technologies. By implementing our latest DSP technology, we hope to further drive the deployment of 3G technology around the world."
In addition to providing DSP technology, NEC also uses TI's wide portfolio of analog products optimized for wireless infrastructure applications including data conversion, power management, clock distribution and radio frequency products.
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