Dekolink Wireless and picoChip to explore WiMAX and 3G coverage systems
December 6, 2006
Dekolink Wireless and picoChip announced their first steps towards collaborating on the development of advanced, in-building products for WiMAX and 3G technologies such as WCDMA and CDMA2000.
Dekolink Wireless and picoChip will jointly explore opportunities to develop future in-building coverage solutions for all relevant technologies such as WiMAX, WCDMA/HSDPA and CDMA2000 1xEV-DO. Combining Dekolink Wireless' RF expertise in coverage enhancement products and picoChip's low cost, versatile chipsets for picocells and femtocells, the two companies will be in prime position to rapidly respond to market requests for cost-efficient, network friendly indoor coverage solutions.
"By teaming up with picoChip, we enhance our capabilities of serving our carrier customers with the most innovative -- and yet cost-effective -- indoor coverage products for applications ranging from SOHO to very large building complexes," says Ken Monro, President of Dekolink Americas. "Additionally, we believe that their developments in areas such as WiMAX and femtocells are consistent with our goals and position as a driver of advanced technology for in-building coverage."
Mobile operators have a critical need to improve indoor coverage and capacity in order to proliferate voice, data and mobile video service opportunities. "We're experiencing a marked increase of interest among carriers globally for well thought out products that deploy quickly and easily while maintaining network integrity," Monro continues.
"We're excited to be working with Dekolink Wireless to introduce compelling new in-building solutions to tier-one carriers," says Guillaume d'Eyssautier, President and CEO of picoChip.
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