TI's $100m 3G plan

date: 22nd February 2001, source by: electronicsweekly.co.uk

Texas Instruments is targeting the development 3rd generation (3G) mobile communications applications with a $100m investment in its DSP software programme.

"Many of us believe the mobile Internet will be big. Few of us can predict exactly where it will go and what applications will be most important to consumers. We need to accommodate applications that encompass the human ability to dream and innovate," said Tom Engibous, president of TI.

The investment is being used to support the company's 3G mobile digital signal processor platform known as OMAP. Engibous said the company was prepared to make equity investments up to $100m over the next 12 to 18 months to help software developers accelerate the creation and deployment of next generation, OMAP-based wireless applications.

The investment program will target investments in software developers and technology partners who want to create new software and hardware, which can then be used on OMAP-compatible devices.

The OMAP software platform is code-compatible with the firm's 3G digital baseband devices such as TMS320C6203 and next generation C64xx DSPs.

"In the age of a mobile Internet, the end-user's experience will begin and end with communications. What happens in the middle is services and content," Engibous said. "The first standard OMAP product is sampling today and will be in production later this year."

TI's 3G DSP customers include Nokia, Ericsson, NEC and Sony.

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