Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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Philips cuts basestation costs with a unique modular approach to
EDGE GSM power amplifier design
February 13, 2003
Royal Philips Electronics announced a new concept for EDGE GSM
basestation design that allows manufacturers to produce a single
RF power amplifier chassis that they can customize to operate in
the 800 MHz, 900 MHz, 1800 MHz or 1900 MHz bands simply by plugging
in appropriate RF driver modules and power transistors. By eliminating
the need to design a separate amplifier assembly for each band,
it simplifies component inventory and logistics and reduces manufacturing
costs.
The development of this unified modular approach to power amplifier
design demonstrates Philips' commitment to staying at the forefront
of EDGE GSM basestation technology, and consolidates its position
as the number-one supplier of LDMOS-based power amplifier solutions
for this market. Philips is the world's top three basestation manufacturers
and the one of the largest volume suppliers of RF power amplifier
components.
"By designing a range of RF driver modules and output transistors
with common mounting arrangements and pinning, containing the necessary
matching and biasing circuitry, we have made the configuration of
EDGE GSM basestation power amplifiers a virtual plug-and-play exercise,"
said Rick Dumont, international product marketing manager for cellular
basestations at Philips Semiconductors.
Each of the four RF driver modules (one for each band) is a fully
integrated 50-ohm module delivering either 2.5W EDGE output power
in the 800 MHz and 900 MHz cellular bands or 3.5 W power in the
1800 MHz and 1900 MHz PCS/DCS bands. A corresponding internally
matched 1-GHz or 2-GHz LDMOS power transistor boosts these EDGE
power levels to 40W in the 800/900 MHz or 1800/1900 MHz bands. Philips'
unique FlexBaseTM technology ensures that the modules have excellent
thermal characteristics, allowing operation at CW powers in excess
of 10W at heatsink temperatures of over 90 degrees.
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