Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

TTPCom and NEC collaborate on dual-mode 3G/2G Chips

February 10, 2005

TTP Communications, the supplier of technology for digital wireless communications, and NEC Electronics Corporation announced that they are joining forces to develop dual-mode chips that will include TTPCom Limited's EDGE/GPRS/GSM silicon and software architecture. This fast-track route to the development of 3G/2G chips will help NEC Electronics increase its presence in the global market.

NEC Electronics is developing a dual-mode 3G/2G chipset to address the growing world market for dual-mode wireless products that can handover to EDGE/GPRS/GSM networks outside pockets of 3G coverage.

"NEC Electronics is one of the leading developers of 3G technology in the world and we are therefore particularly pleased that we are working with them to incorporate our 2G/2.5G architecture into their dual-mode chips," stated Julian Hildersley, Managing Director of TTPCom's Silicon Business Unit. "TTPCom has long recognised the pressure on R&D budgets in the wireless industry and its objective in silicon is to deliver stable solutions that save time and money by allowing customers to focus their R&D efforts on their strongest differentiators, and employ TTPCom's solutions when time-to-market is most important."

"TTPCom's GSM/GPRS technology has become an industry standard, and the company is one of only a few companies to offer an effective EDGE solution today," stated Masakazu Yamashina, general manager, Mobile Systems Division, NEC Electronics. "We were impressed with how easily we were able to integrate TTPCom's solutions with our own to develop dual mode 3G/2G baseband LSIs. This has accelerated the delivery schedule for the chips and will have a significant impact on our ability to increase our presence in the global market."

Kiyohide Ikeda, Country Manager TTPCom Japan added, "With a longstanding involvement in the GSM market and in Japan, TTPCom is an ideal partner for companies looking to develop dual-mode products for the worldwide mobile market. NEC Electronics will benefit from the proximity of a support team in Japan, and we look forward to a long and fruitful relationship."