Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

CYIT licenses ZSP500 to meet needs of TD-SCDMA devices

February 27, 2005

The LSI Logic Corporation ZSP Product Division announced that Chongqing Chongyou Information Technology (CYIT), a major developer of 3G mobile handsets and chips in China, has licensed the ZSP500 digital signal processor (DSP) core. Having recently licensed the ARM926EJ, CYIT will adopt both the ARM and ZSP processors to develop chips designed specifically for the Chinese domestic 3G standard, TD-SCDMA.

"China currently has sales of over five million handsets a month," said Allen Nogee, a principal analyst with In-Stat. "China's investment in the new TD-SCDMA standard will enable the rapid spread of telecommunications to China's thinly populated areas and the broad transmission bandwidth needed for access to the Internet. With this type of market potential in the world's largest populated country, the adoption of the ZSP500 by CYIT represents a significant design win for the ZSP architecture, which is quickly becoming a DSP-of-choice for 3G wireless designs."

CYIT selected the ZSP500 core for its unique ability to deliver quad-MAC capabilities in a very efficient footprint, low power consumption and best-in-class code density, making it ideal for the demands of high bandwidth 3G baseband processing and media-rich applications. In June 2003, CYIT was the first company to demonstrate a TD-SCDMA-based mobile phone prototype. Having now secured licenses for both the ARM9E and ZSP500 processors, CYIT anticipates developing its commercial TD-SCDMA mobile phone chipset by Q3 2005.

"The ease-of-integration of the ZSP500 enabled our rapid development of a low-power, high-performance TD-SCDMA solution," said Neng Nie, chairman of CYIT and president of ChongQing University of Posts & Telecom. "The power and performance of the ZSP500 combined with the expert support of the ZSP team was a winning solution for CYIT's next-generation wireless applications. We look forward to working with LSI Logic into the future as the 3G market grows."

George Liao, managing director of APAC, DSP Products Division of LSI Logic, added, "TD-SCDMA is a very important market for ZSP and we are pleased that CYIT has selected the ZSP500 for its design. The ZSP engineers have developed specific expertise in the TD-SCDMA standard to support our customers in developing the optimum system solution."