Freescale's MXC 3G processor receives award
February 12, 2006
The Freescale Semiconductor MXC91321 3G processor was awarded the Microprocessor Report Analysts' Choice Award for Best Applications Processor for 2005. The MXC91321 processor is the first to integrate a 3G single core modem with applications processor functionality. The chip is the heart of the MXC300-30 platform, which provides a comprehensive UMTS/HSDPA solution including integrated baseband and applications processor, RF transceiver, power amplifier and power management IC.
In conjunction with the award, Freescale disclosed that it is beginning to sample its 65 nanometer (nm) version of the MXC EDGE processor. This MXC processor utilizes a StarCore DSP for single core modem functionality up to 156 MHz and an ARM11 core for applications processing with speeds of up to 532MHz. Additionally, this 65nm product reduces power consumption by more than 40 percent compared to previous offerings, making it the most advanced processor in the industry for power and speed combined.
"Freescale is honored to receive one of the industry's highest recognitions from Microprocessor Report for the MXC 3G processor, which was a collaborative development effort between Motorola and Freescale," said Franz Fink, senior vice president and general manager of Freescale's Wireless and Mobile Systems Group.
Now in its seventh year, the Microprocessor Report Analysts' Choice Awards are judged by In-Stat's technology analysts, the team behind the internationally recognized newsletter "Microprocessor Report" and the annual Spring and Fall Processor Forums.
"We unanimously voted to award Freescale's MXC91321 the Microprocessor Report Analysts' Choice Award for Best Applications Processor for 2005," said Max Baron, senior editor for Microprocessor Report and principal analyst with market research firm In-Stat. "Aimed at wireless handheld applications, the MXC91321 boasts an impressive roster of major architectural achievements including the integration of baseband, control, and applications on one chip employing fewer cores with resulting smaller die size and price."
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