TTPCom announces Matsushita as 3G technology licensee

date: January 17, 2002

TTP Communications, the independent supplier of technology for digital wireless communications, today announces Matsushita Electric Industrial as a licensee of its dual system 3G/GSM technology for radio chipsets.

Under the licence agreement, MEI will be able to manufacture Radio Frequency Integrated Chipsets ("RFICs") based upon designs supplied by TTPCom for use in next generation mobile terminals made by MEI and other terminal manufacturers.

Mr. Takaharu Saeki, General Manager of ALSI Division, Matsushita Electric Industrial said, “TTPCom is one of the world’s most successful developers of RF and baseband solutions for GSM/GPRS and 3G cellular systems, and it was these skills we sought to leverage to create a true open market RF offering as the 3G era arrives. We believe our collaboration has established a unique approach to building RFICs that existing and new handset partners can drop into forthcoming designs with minimal design effort”.

“Our experience with GSM/GPRS and intimate knowledge of UMTS 3G specifications enables us to offer a uniquely attractive proposition to the world's largest semiconductor and handset manufacturers", said Tony Milbourn, Managing Director of TTP Communications. "The strength of our 3G offering is demonstrated by the quality of customers prepared to manufacture next generation technology based on our expertise".

TTPCom dual system 3G/GSM RF technology will enable terminals such as handsets that are capable of operating with 2G/2.5G and 3G networks, allowing subscribers seamless access to different networks as the world’s cellular operators roll out new 3G offerings.

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