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Datang, Philips and Samsung form TD-SCDMA joint venture
January 20, 2003
Datang Mobile Communications Equipment (Datang Mobile), Royal Philips
Electronics and Samsung Electronics today announced the formation
of a joint venture company, named T3G. T3G will design and license
core TD-SCDMA chipsets and reference designs for mobile terminals
and end-user equipment. The company aims to provide a complete solution
(reference design, hardware and software) for handset manufacturers
and cellular phone design houses in order to speed up the production
of the first commercial TD-SCDMA handsets, likely to be available
in 2004.
The availability of the T3G reference design will speed up the
development of cost-effective dual mode TD-SCDMA/GSM handsets in
China, a factor which will ease operators' migration from second
to third generation networks. With limited capital outlay operators
will be able to immediately increase capacity, enabling them to
improve profitability by building subscriber numbers for 2.5G and
3G services simultaneously. Operators will therefore be in a position
to roll out reliable mobile broadband services in line with demand.
T3G plans to produce core chipsets and reference designs for TD-SCDMA/GSM
(GPRS) dual-mode mobile handsets that will be brought to market
by Samsung and other handset manufacturers. The technology is designed
to reduce the current bottlenecks in the development of 3G handsets
by providing benefits including reduced power consumption and improved
standby time. The collaboration combines Datang's TD-SCDMA expertise,
Philips' cutting-edge semiconductor design and process capability
and Samsung's leadership in mobile handset creation. Each partner
has invested considerable resources, including capital, technology,
personnel and marketing.
"We have already successfully developed a TD-SDCMA test terminal
and feel that the time is right to accelerate the availability of
the first commercial products." commented Mr. Zhou Huan, president
of Datang Mobile. "We strongly believe that our collaboration with
Philips and Samsung, both at the forefront of their respective fields,
will accelerate the commercialisation of TD-SCDMA and thus contribute
to the development of the TD-SCDMA industry."
"Our involvement in T3G will enable us to deliver advanced chipsets
compatible with most of the world's 3G networks." commented Thierry
Laurent, executive vice president business unit mobile communications
at Philips Semiconductors.
Mr. Shin, Jong Kyun, vice president of mobile communication division
at Samsung added: "China is the world's largest market for mobile
phones but there is still considerable untapped demand. Through
T3G's solution, Samsung plans to introduce commercial handsets in
2004 that will help the TD-SCDMA reach its full potential. By accelerating
the time to market for TD-SCDMA handsets we hope to help the standard
reach a critical mass of subscribers in record time."
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