Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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TTPCom and MEI achieve first 3GPP compatible 3G RFIC
January 22, 2003
TTPCom and Semiconductor Company of Matsushita Electric Industrial
(MEI), have reached a significant milestone in achieving functional
first silicon of a 3GPP transceiver design based on TTPCom technology.
The first devices have been evaluated and shown to meet the specifications
set for 3GPP. Full system evaluation is now underway at TTPCom’s
testing facilities, with first production samples expected in the
second half of 2003.
The TTPCom reference design delivered to MEI was optimised to meet
their specific requirements for a 3GPP only transceiver. Development
of a dual GSM / 3G transceiver continues, with first silicon expected
in mid 2003.
“Bringing together the systems expertise and experience of TTPCom
with the silicon design expertise of our team enabled us to reduce
development time for the 3G transceiver,” said MEI Product Manager,
Hiroyuki Ushihara. He continued, “The cooperation worked very well
and TTPCom continues to work with us supporting the discussions
we are having with handset manufacturers who are interested in using
our RFICs”.
TTPCom’s RFIC core Product Manager, Gerry Stanton said “We are
very pleased to see working 3GPP RFICs on the bench. Our teams worked
closely to optimise our reference IP to meet the MEI design goals.
Seeing working silicon validates our IP, MEI’s circuit design and
our model of co-working”.
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