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TTPCom and MEI achieve first 3GPP compatible 3G RFIC

January 22, 2003

TTPCom and Semiconductor Company of Matsushita Electric Industrial (MEI), have reached a significant milestone in achieving functional first silicon of a 3GPP transceiver design based on TTPCom technology.

The first devices have been evaluated and shown to meet the specifications set for 3GPP. Full system evaluation is now underway at TTPCom’s testing facilities, with first production samples expected in the second half of 2003.

The TTPCom reference design delivered to MEI was optimised to meet their specific requirements for a 3GPP only transceiver. Development of a dual GSM / 3G transceiver continues, with first silicon expected in mid 2003.

“Bringing together the systems expertise and experience of TTPCom with the silicon design expertise of our team enabled us to reduce development time for the 3G transceiver,” said MEI Product Manager, Hiroyuki Ushihara. He continued, “The cooperation worked very well and TTPCom continues to work with us supporting the discussions we are having with handset manufacturers who are interested in using our RFICs”.

TTPCom’s RFIC core Product Manager, Gerry Stanton said “We are very pleased to see working 3GPP RFICs on the bench. Our teams worked closely to optimise our reference IP to meet the MEI design goals. Seeing working silicon validates our IP, MEI’s circuit design and our model of co-working”.

 


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