Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

Intel chips expected to be in DoCoMo 3G handsets

January 15, 2004

Intel's chips could be used in NTT DoCoMo's 3G FOMA handsets by the end of the year, the chip maker said. The new all-purpose chip combines communications, software applications and memory functions in a single piece of silicon.

Kaz Yoshida, co-president of the Intel's Japan unit, said his company has already shipped samples and expects them feature in DoCoMo 3G handsets in late 2004 or early 2005.

Intel is better known for making computer chips but is only a small player in the cellphone market. It's new is said to be cheaper, more energy efficient and tape up less space than separate chips that are currently used in 3G handsets. The early FOMA handsets were bulky in size and eats up the battery too quickly. Sales of FOMA handsets picked up when smaller and improved handsets came out. Intel's chip will give the DoCoMo's gradually improving service an extra boost and competitive advantage.

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