Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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NEC licenses USB technology from TransDimension for 3G
January 26, 2004
TransDimension, a provider of USB connectivity solutions for embedded applications, announced that NEC Electronics Corporation (TSE), a provider in Large Scale Integration (LSI), has licensed its USB On-The-Go (OTG) technology to integrate into their next generation LSI chip for 3G mobile phones. The announcement with NEC Electronics marks TransDimension's entry into the Japanese cellular phone market.
Through TransDimension's USB OTG technology, NEC Electronics will leverage the readily available USB standard to obtain direct connectivity for its 3G phones with other mobile devices and computer peripherals. USB OTG will greatly enhance the connectivity feature set of 3G phones by providing access to other smart devices, like digital cameras, PDA's and computer peripherals to exchange data without the aid of a PC.
"The next-generation of mobile phones will be required to offer a rich multimedia experience to the end-user. A necessary part of that experience will be the ability to share data with other users through direct connectivity to other smart devices," said Rick Goerner, TransDimension president and CEO.
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