TI licenses 3G cell phone chipsets

date: July 31, 2001 - source: Texas Instruments

ARM and Texas Instruments Incorporated announced that TI has signed an agreement to license and develop enhanced solutions based on the new ARMv6 architecture. This advanced architecture will enable TI to be the first to deliver increased system performance and battery life for next-generation (2.5 and 3G) wireless handsets by seamlessly connecting its programmable digital signal processors with the new ARM(r) architecture.

"We expect that the combination of TI's industry-leading DSP technology with the ARMv6 microprocessor architecture will enhance TI's OMAP architecture offering as an important standard for next-generation wireless multimedia devices." said Robin Saxby, chairman and CEO, ARM.

The ARMv6 architecture enables high levels of integration between TI's leading DSP technology and ARM's advanced microcontroller architecture. The two year-long collaboration between ARM and TI led to the incorporation of several new features in the next-generation architecture to improve data synchronization, shared memory management, and the efficient operation of advanced operating systems (OS). These new features, along with others, will offer the increased performance and low-power consumption required to run real-time audio and video applications.

"By seamlessly combining TI's next-generation DSP technology with the first microprocessor core based on the ARMv6 architecture, we will extend this standard in 2.5 and 3G wireless devices including TI's OMAP architecture, established as the de facto standard for next-generation wireless handsets and advance mobile information devices." said Gilles Delfassy, senior vice president, general manager, TI Wireless Business Unit.

In a separate agreement, TI has licensed the ARM9E Jazelle extensions. These extensions enable enhanced performance of Java technology-based multimedia applications used in 2.5 and 3G wireless appliances.

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