Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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ANADIGICS supplies 3G PA to ZTE's F866 handset
July 11, 2006
ANADIGICS announced that the company is supplying indium gallium phosphide (InGaP) heterojunction bipolar transistor (HBT) power amplifiers (PAs) to ZTE for the F866 WCDMA handset. The F866 features an integrated MP3 audio player, digital camera with video capabilities, and two-inch color screen. ANADIGICS' AWT6252 IMT-band wideband CDMA (WCDMA) PA provides ZTE with the performance and reliability needed for the advanced design of the F866.
"We are pleased that ZTE has selected our world-class power amplifiers for the F866 3G handset," said Dr. Ali Khatibzadeh, Senior Vice President and General Manager of Wireless Products at ANADIGICS. "ANADIGICS' 3G power amplifier portfolio is now enabling handsets, PDAs, data cards, and embedded modules from some of the world's largest manufacturers. We look forward to continue supporting ZTE in its rapidly expanding 3G business."
The AWT6252 4 mm by 4 mm PA module optimizes efficiency for different output power levels and offers a shutdown mode with low leakage current. This PA provides 41% power added efficiency at 27.5 dBm and 22% power added efficiency at 16 dBm, resulting in superior handset talk and idle times. This module utilizes advanced InGaP HBT technology to provide state-of-the-art reliability, temperature stability, and ruggedness.
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