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Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

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Milestones achieved for HSUPA technology

July 19, 2006

QUALCOMM announced that the Company has achieved significant milestones toward bringing fully wireless broadband capabilities to WCDMA (UMTS) networks in 2007, including:

-- Successful completion of the industry's first HSUPA test calls delivering 2.0 Mbps on the uplink

-- Launch of interoperability testing with multiple infrastructure providers

QUALCOMM will be demonstrating 2.0 Mbps uplink video streaming and file transfers at EXPO COMM Japan 2006, July 19-21 in Booth #C-285.

"QUALCOMM's technology leadership has made possible the successful accomplishment of these milestones, bringing richer broadband wireless entertainment, personal convenience and enterprise services closer to reality," said Alex Katouzian, senior director of product management for QUALCOMM CDMA Technologies. "Additionally, our close collaboration with device manufacturers, operators and infrastructure vendors is quickly driving HSUPA to market for wireless users around the world."

For WCDMA (UMTS) networks, HSUPA technology, together with HSDPA technology, delivers data speeds surpassing those of many home broadband connections. QUALCOMM's Mobile Station Modem (MSM) MSM7200 chipset, the industry's first HSUPA solution, was used for the test calls and interoperability testing. Ten leading device manufacturers are already designing handsets based on the chipset, which offers industry-leading levels of integration to deliver significant bill-of-materials savings and to enable slim, sleek devices with support for advanced multimedia and data capabilities.

 

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