InterDigital presents advanced HSDPA/HSUPA architecture

June 20, 2006

InterDigital Communications announced that Dr. Behrooz Lessani, Vice President of Business Development for InterDigital, will present findings from the company's advanced research and development of HSxPA solutions at the HSxPA Conference being held in Prague, Czech Republic, June 20-22.

HSxPA technology describes the 3G cellular High Speed Packet Access protocol that combines both the High Speed Downlink Packet Access (HSDPA) and High Speed Uplink Packet Access (HSUPA) modes for high performance WCDMA systems. HSxPA brings dramatic improvements to the overall capacity and data speeds of 3G networks and provides a true broadband experience for mobile voice, data, and multimedia.

InterDigital is among the first companies to develop a fully functioning HSDPA modem solution. InterDigital's HSDPA solution is currently being integrated by several leading semiconductor companies. In addition, the company is developing an HSUPA modem compliant with Category 6 capable of uplink data speeds of 5.76Mbps.

Dr. Lessani's presentation on "Examining The Challenges In Combining HSUPA With HSDPA" highlights:

-- Careful design considerations needed for future complex HSxPA-enabled converged devices

-- Appropriate use of software-controlled hardware accelerators as key to achieving high data rates, low latency and low power consumption

-- Diversity advanced receiver as a preferred approach for high rate downlinks

-- HSDPA + HSUPA benefiting downlink intensive, uplink intensive and symmetric services

-- VoIP combined with other IP-based applications highlighting the capacity advantage of HSDPA/HSUPA.

"By sharing our expertise in advanced 3G modem development with mobile chip makers, terminal unit manufacturers, and network operators, InterDigital continues to lead in advancing the wireless industry," commented Mark Lemmo, Senior Business Development and Product Management Officer.