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Ericsson and Texas Instruments sign joint agreement on GPRS and 3G handset solutions

date: March 14, 2002

As an extension of a memorandum of understanding signed last September, Ericsson Mobile Platforms and Texas Instruments have signed an agreement for GPRS and 3G reference design platforms based on TI's advanced silicon technology.

Ericsson will offer third generation mobile phone reference design platforms including TI semiconductor solutions enabling wireless equipment manufacturers to bring their products to market faster and with reduced R&D investment.

Ericsson Mobile Platforms' open solutions will include digital signal processors for baseband, RF components as well as application processors. Under the agreement, Texas Instruments will supply the core components for Ericsson's reference design solutions. These solutions will support a full range of handsets, addressing all market segments, including bandwidth-intensive and multimedia-rich wireless applications enabling services such as multimedia messaging, video and Internet audio downloads, e-mail, real-time Web browsing, advanced security, games and location-based services.

"We are pleased to support Ericsson Mobile Platforms' solutions as a strategic TI-powered UMTS offering to the 3G market," said Gilles Delfassy, TI Senior Vice President and General Manager for TI's Wireless Terminals Business Unit.

"This joint agreement along with Ericsson's 2.5G and 3G Intellectual Property Rights portfolio will give our customers access to leading wireless solutions for GPRS and 3G handsets", said Tord Wingren, President of Ericsson Mobile Platforms.

With today's announcement, Ericsson is also demonstrating its early-to-market position within the 3G space. Already in February Ericsson Mobile Platforms started shipment of platforms in early 3G phone prototypes, which are now running in Ericsson networks.

Volume production ramp of the dual-mode GPRS/UMTS reference platforms is expected in the fourth quarter of 2002.

 


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