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IBM licenses 3G/GSM radio chipset technology from TTPComdate: March 20, 2002 TTPCom, an independent supplier of technology for digital wireless communications, announced that IBM has licensed its dual system 3G/GSM technology for radio chipsets. TTPCom’s technology delivers a system level and architectural design together with IC specifications from which IBM can rapidly develop low power RFICs, based on its industry leading SiGe technology, for use in next generation wireless devices. “The combination of TTPCom’s IP and IBM’s leadership in silicon germanium (SiGe) technology will enable us to broaden our circuit portfolio and meet 3G demands,” said Ken Torino, director, wireless products, IBM Microelectronics. IBM was the first company to broadly manufacture silicon germanium products. TTPCom's dual system 3G/GSM RFIC architecture enables the design of terminals, such as handsets, capable of operating with 2G, 2.5G and 3G networks, allowing subscribers seamless access to these different network standards as the world’s cellular operators migrate to 3G services. "We’re very pleased to be working with IBM on 3G/GSM dual system RFIC development", said Gordon Aspin, Operations Director, TTPCom, "This is our second licence agreement for 3G radio chipsets, which demonstrates that the market sees the value in TTPCom’s IP based approach to RFICs. This IP gives our clients instant access to our extensive RF design expertise and enables them to benefit from our familiarity with GSM and 3G standards."
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