Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

NTT DoCoMo uses bioplastic from NEC for FOMA phones

March 22, 2006

NEC Corporation (NEC) and UNITIKA announced the joint development of bioplastic reinforced with kenaf fiber, which is expected to contribute greatly to environmental measures for mobile phones. NTT DoCoMo is already using this new material in the entire casing of its new FOMA "N701iECO" mobile phone, which it launched on the Japanese market on March 10, 2006.

Biomass-based bioplastics, such as polylactic acid (PLA) that is made of corn, have been drawing attention in recent years as new materials to replace conventional petroleum-based plastics, amid increasing interest and concern over environmental problems such as global warming and resource depletion. However, application of regular PLA to electronic devices is difficult as it has insufficient heat resistance and strength.

NEC succeeded in improving the heat resistance and strength of PLA by adding kenaf fiber to it, one measure for the prevention of global warming. Then together with UNITIKA it realized the durability of the new material by applying it to the components of a PC. More recent research carried out by both companies involved the further improvement of the characteristics of the kenaf fiber-reinforced PLA in order to allow its application to mobile phones. Its moisture resistance was improved by UNITIKA, using their commecialized PLA "TERRAMAC." Fall impact durability was increased by adding a biomass-based flexibilizer and a reinforcing filler that NEC developed for this resin. In addition, moldability was further advanced by using original additives that were jointly developed by NEC and UNITIKA.

The newly developed bioplastic achieves the highest biomass ingredient ratio out of all bioplastics that are currently being used in electronic devices, with a ratio of approximately 90%. It simultaneously realizes a high level of fall impact durability, moldability and heat resistance, which are all desired features for mobile phone casing.

Features of the new bioplastic

Heat resistance was dramatically improved by adding kenaf fiber as a reinforcing agent to the polylactic acid, a typical bioplastic material. In addition, by adding a biomass-based flexibilizer and reinforcing filler, which have special compositions, the fall impact durability and strength characteristics have been improved.

Through a composition that is based on special biomass material including kenaf, other biomass-based additives and PLA, a high biomass ingredient ratio of approximately 90%, the highest in the range of bioplastics for electronic devices, has been achieved.