UltraRF teams with Toracomm in development of 3G ready modules

date: May 9, 2001

UltraRF manufacture of RF power semiconductors announced it has awarded prototype design work to Toracomm of England. Under the contract, Toracomm will design and prototype for UltraRF a new range of 3G ready base-station power amplifier modules.

These 3G ready modules are being designed to deliver high levels of performance in low cost, miniature alumina modules, supporting the wireless industry drive toward ever smaller, cost-competitive solutions for the emerging 3G market. The low cost will provided to be an important issued to drive down cost of 3G rollout.

"Creating a full range of low-cost power amplifier modules is an important strategic goal for us, and it is time critical. We believe we are on target to deliver our new product program in line with the industry's tough deadlines, positioning us to advance PA modules for 3G wireless infrastructure.'' said Chris Tubis, UltraRF president.

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