Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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TI and ST Enter cdma2000 Market, Leverage Joint Development with Nokia
May 19, 2003
Wireless industry leaders join efforts to stimulate an open environment
for CDMA handsets - STMicroelectronics, Texas Instrument, and Nokia announced
that TI and ST will offer ICs, based on technology developed jointly with
Nokia that together compose standard CDMA chipsets. The chipset ICs will
be marketed by ST and TI to handset manufacturers for cdma2000 1X and
1xEV-DV mobile handsets. This technology has been incorporated in the
Nokia-specific chipset used in its cdma2000 1X phones, and following generations
of this technology will be used in Nokia-specific chipsets for future
1xEV-DV handsets. Availability of qualified samples of the cdma2000 1X
chipset is expected next quarter.
"CDMA handset manufacturers now have unprecedented choices to design
innovative and competitive cdma2000 wireless products based on these open,
standard CDMA chipset solutions from ST and TI," said Gilles Delfassy,
senior vice president of TI's wireless business unit. "This will stimulate
healthy competition in the CDMA market and fuel the growth and evolution
of handset designs, features and roadmaps." TI and ST are uniting elements
of their respective technologies into a portfolio of ICs forming CDMA
chipsets which target multiple market segments and present handset manufacturers
with flexibility and choice through open hardware interfaces, including
interfaces to RF subsystems and application processors. An open Application
Programming Interface (API) that will facilitate customization of products
and accelerate the proliferation of easily portable applications onto
this platform provides additional flexibility. The chipsets will provide
reduced bill-of-materials cost compared to similar offerings, low-power
consumption for both standby and talk times, and the benefit of suppliers
with world-class production facilities and proven wireless chipset expertise.
In addition to the initial CDMA chipset targeting the cdma2000 1X standard,
handset manufacturers will also have a time-to-market advantage for future
cdma2000 1xEV-DV handsets with the industry's first complete chipset for
this market.
"To accelerate the growth of the CDMA market, it is essential to give
handset manufacturers a choice of competitive solutions and suppliers.
By combining our complementary strengths, TI and ST are uniquely positioned
to stimulate the rapid growth of this market by jointly offering the most
competitive chipset ICs," said Aldo Romano, corporate VP and general manager
of ST's Telecommunications, Peripherals and Automotive groups.
The complete CDMA chipset solutions based on this proven technology,
developed jointly with or licensed from Nokia, will include an analog
baseband/power management chip, a digital baseband chip, associated protocol
software, RF chips and reference designs. Development and testing tools,
as well as world-class support around the globe will be available from
both companies for their respective ICs. "In order to help create new
alternatives and greater opportunity in the CDMA marketplace, Nokia is
working with TI and ST who in turn are developing a viable, proven alternative
to what already exists in the market. This ensures that CDMA operators
gain the benefits of an open, flexible technology that can only be achieved
in a true multi-vendor environment," said Soren Petersen, senior vice
president and general manager of Nokia Mobile Phones CDMA business.
In addition to the CDMA chipset solutions, ST and TI will make available
their own complementary wireless technologies including applications processors,
which support the OMAPI standard, wireless LAN, Bluetooth, and GPS location
technology. ST offers Flash memory products as an option to complement
the chipset. Both ST and TI offer customers leading-edge semiconductor
manufacturing capabilities with the demonstrated ability to support high-performance,
low-power, and cost-effective silicon in high-volume production.
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3G Motorola A920
