Qualcomm introduces radioOne RF CMOS dual-mode solution for WCDMA and GSM/GPRS/EDGE
May 13, 2004
Qualcomm announced further steps to reduce development costs for WCDMA (UMTS) markets worldwide with the introduction of the radioOne RTR6275 solution. The RTR6275 device is the wireless industry's first single-chip RF CMOS (Complementary Metal Oxide Semiconductor) transceiver for dual-mode WCDMA /HSDPA and GSM/GPRS/EDGE (EGPRS) terminals. The RTR6275 device integrates a WCDMA transceiver and quad-band EGPRS transceivers into a single-chip, enabling cost optimized, smaller form factor devices for mainstream WCDMA markets. Samples of the RTR6275 are expected to ship in the second quarter of 2005.
Qualcomm also announced the sampling of the complementary RFR6275 receive device, which extends the functionality of the RTR6275 transceiver to include support for HSDPA receive diversity.
"The introduction of the wireless industry's first RF CMOS single-chip transceiver for WCDMA and EGPRS furthers our commitment to providing cost-effective solutions that will help grow the WCDMA market," said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies. "Qualcomm's WCDMA strategy includes support for all market tiers, providing our manufacturer and operator partners with the range of options necessary for revenue-generating products and services."
Qualcomm's first RF CMOS solution for WCDMA /HSDPA and EGPRS is a three-chip, complete solution addressing the majority of global 3G WCDMA markets, which includes the RTR6275 transceiver, the MSM6275 Mobile Station Modem (MSM) chip and the PM6650 powerOne power management device. This solution provides support for WCDMA /HSDPA at 1800 or 1900 or 2100 MHz and GSM/GPRS/EDGE uplink (UL)/downlink (DL) at 850/900/1800/1900 MHz.
The RTR6275 transceiver solution uses low-cost RF CMOS process technology, a low-cost, high-volume digital process technology used for a majority of today's digital computer microchips. The RTR6275 device integrates low-noise amplifiers (LNA), receivers, transmitters, voltage controlled oscillators (VCO) and phase locked loops (PLL), and is packaged in an 8mm x 8mm, 56-pin Quad Flat No-Lead (56QFN) package for further space savings advantages.
The MSM6275 chipset delivers peak data rates of 1.8 Mbps and provides support for EDGE and HSDPA, a next-generation WCDMA technology.
Qualcomm's radioOne Zero Intermediate Frequency (ZIF) architecture eliminates the need for Intermediate Frequency (IF) components. With the radioOne technology, Qualcomm's MSM chipsets require less printed-circuit-board area than previous generations and reduce time-to-market development and bill-of-materials (BOM) costs.
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