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Two New Developers Gives Easy Path to Deliver 2.5 and 3G Symbian-Based Applicationsdate: November 15, 2001 Adding to its worldwide network of Independent OMAP Technology Centers, Texas Instruments (TI) today announced two new TI-licensed companies that extend development support and training capabilities for developers who use TI's OMAP processing platform for 2.5G and 3G wireless devices. By collaborating with TI, system integrators Digia Incorporated and Teleca Limited will assist wireless handset manufacturers to rapidly deliver next-generation wireless devices, and enable Symbian OS software developers to quickly create multimedia-rich wireless applications. "By adding Digia and Teleca to its Independent OMAP Technology Center initiative, TI is delivering an attractive opportunity for wireless software programmers to write handset-independent applications including streaming multimedia, mobile commerce and wireless security applications that will run on Symbian-based 2.5 and 3G devices," Mark Edwards, executive vice president of sales and marketing, Symbian. "We see these companies offering thousands of Symbian OS developers the expert access to quickly create applications for next-generation wireless devices." "Digia and Teleca extend TI's development support capabilities by bringing together extensive wireless system integration expertise, training and product support to 2.5 and 3G wireless handset manufacturers and OMAP developers," said Alain Mutricy, general manager of TI's OMAP platform. "By closely working with TI and Symbian, these two companies will help accelerate the delivery of next-generation wireless applications to the marketplace."
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