DoCoMo and Intel to develop 3G chips and beyond

November 17, 2003

Japanese service provider NTT DoCoMo and America's Intel have agreed to co-develop advanced semiconductors for 3G mobile handsets, according to the Nihon Keizai Shimbun.

Both firms is looking to develop low-cost energy-efficient chips capable of multitasking such as data communication and image processing that would be available within a few years.

"It is true that we are going to co-develop chips for 3G phones," a DoCoMo spokesman said.

"But it is ultimately handset makers like NEC and Matsushita that pick chips for their handsets. We are just going to offer better options for them."

DoCoMo's current 3G handsets have been plagued by short talk and standby time but the new chips could give DoCoMo's handsets improved battery life.

Intel is the world's largest chipmaker but is still a small player in semiconductors for mobile phones. In addition,

DoCoMo and Intel have agreed to develop fourth generation technology that is expected to become commercially available as early as 2010 and offer data transfer speeds to similar level as fibre-optic networks.

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DoCoMo and Intel to develop 3G chips and beyond

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