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TI and COMMIT enable chipset for 3G in China
November 17, 2004
COMMIT Incorporated, a research and development joint venture with Chinese communications equipment manufacturers, and Texas Instruments (TI), are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customized for supporting complex 3G applications. The TI and COMMIT solution incorporates TI's OMAP multimedia processors and digital signal processing (DSP) technology. TI and COMMIT will be demonstrating a 3G TD-SCDMA prototype handset developed by one of its customers, which includes TI's OMAP processor and tested with various infrastructure partners, during the 3G World Congress in Hong Kong.
Working together to drive 3G growth in China, the TI and COMMIT chipset provides an open, trusted alternative chipset solution to the Chinese wireless industry, which until recently has been dependent on imported technology. Locally designed to support TD-SCDMA, the "home grown" 3G standard for China, the COMMIT and TI chipset solution enables handset manufacturers to dramatically shorten their time to market, thus speeding up the industrialization process of the 3G TD-SCDMA industry. TD-SCDMA is becoming an important technology for Asian operators for both their current and evolving networks in order to support efficient high-speed packet data services.
COMMIT recently announced its complete chipset solution and architecture for TD-SCDMA terminals integrating TI technology, including the RF, analog baseband and digital baseband chip, TI's OMAP processor, and its protocol stack software, which support the TD-SCDMA voice and data requirement. The complete chipset solution will be ready for mass production in 2005. Handset manufacturers such as LG, Bird and DBTel are already developing TD-SCDMA terminals based on the TI and COMMIT chipset solution. As of today, COMMIT is the only company currently offering a complete chipset solution for TD-SCDMA terminals, allowing COMMIT to better manage evolving product requirements and to control the cost and the performance of the total solution.
"3G is picking up steam around the globe, and China is no exception," said Gerald Kuo, TI China Managing Director. "Through the cooperation between COMMIT and TI, COMMIT is able to provide a complete TD-SCDMA terminal solution compliant with 3GPP standards."
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