Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

TI samples 3G solution jointly developed with DoCoMo

November 30, 2005

Fulfilling a commitment made last year to jointly develop 3G solutions with NTT DoCoMo, Texas Instruments (TI) announced it has sampled a cost-competitive, multi-mode UMTS chipset developed with NTT DoCoMo to serve the worldwide 3G handset market. Part of TI's OMAP-Vox architecture, the new OMAPV2230 solution is an integrated UMTS dual-mode digital baseband processor and advanced applications processor based on TI's high-performance OMAP 2 architecture, TI's proven GSM/GPRS technology, and NTT DoCoMo's established WCDMA technology.

"The new OMAPV2230 solution will help NTT DoCoMo expand its 3G FOMA subscriber base by offering more affordable 3G handsets with the most advanced multimedia applications allowing a richer user experience with mobile digital TV, music and gaming," said Koji Chiba, Managing Director of Customer Equipment Development Department, NTT DoCoMo. "NTT DoCoMo is pleased to achieve this next step in our 3G collaboration with TI. With our combined best-in-class systems expertise, NTT DoCoMo and TI have developed the cost-efficient OMAPV2230 to drive widespread adoption of 3G phones delivering high-performance multimedia applications."

Part of TI's OMAP-Vox wireless platform, the OMAPV2230 solution takes advantage of the latest advancements of the OMAP 2 architecture and will deliver the latest in 3G mobile entertainment applications, such as video at VGA 30 frames per second, up to 5-megapixel camera, interactive 3D gaming, digital camcorders and mobile TV. Additionally, the OMAPV2230 solution enables optimized multimedia services. As part of TI's wireless roadmap, the OMAPV2230 device will include multi-mode EDGE and HSDPA based on TI technology. This is TI's second-generation of processors to use 90-nanometer technology.

"The new product jointly developed by TI and NTT DoCoMo will accelerate further expansion of 3G mobile handsets featuring various mobile entertainments including the latest gaming and TV conference," said Tatsuru Kojima, General Manager of Mobile Terminal Division, NEC. "We expect that with their new product, we could broaden the choices to expand our business in the global market."

"Panasonic is pleased to leverage TI and NTT DoCoMo technology to extend the current leading-edge multimedia application to the UMTS market. With this solution, it makes it possible to develop cost-efficient 3G mobile phones and Panasonic is excited to expand the 3G handset usage in the worldwide market" said Toshinori Hoshi, Member of the Board, Director of Mobile Terminal Division 1 of Panasonic.

The OMAPV2230 solution is the first UMTS solution in TI's OMAP-Vox wireless platform, which merges both modem and advanced application processing functionality onto the existing OMAP architecture and allows manufacturers to easily reuse investments across multiple market segments and air interfaces. OMAP-Vox solutions share a common software platform that can be re-used for a variety of growing market requirements to bring overall development costs down. The OMAP-Vox platform provides a natural migration path for TI's 2.5G customers and saves years of design effort so manufacturers can quickly and cost-effectively deliver 3G handsets to the mass market.

"TI is proud to work with industry leaders like NTT DoCoMo, NEC and Panasonic," said Alain Mutricy, TI's vice president and general manager of Cellular Systems for its Wireless Terminals Business Unit. "With more than 50 percent share of the UMTS semiconductor marketplace, TI continues to lead in 3G in 2005. The launch of the new OMAPV2230 device will strengthen our lead by providing a standard solution for manufacturers."