Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

IDT and TI enables faster 3G base station development

November 13, 2006

IDT (Integrated Device Technology), a provider of vital semiconductor solutions, announced achievement of full interoperability between the IDT pre-processing switch (PPS) and the highest performance digital signal processors (DSP) from Texas Instruments (TI). Through this strong collaboration, both IDT and TI developed a robust 3G base station development platform that speeds customer time to market by jumpstarting mission critical software programming and enabling rapid, early prototyping. These efforts enable IDT and TI to build-out the Serial RapidIO ecosystem through the development of an interoperable baseband processing solution, providing wireless base station designers an excellent means to achieve higher-performance digital signal processing. The development platform integrates the IDT PPS with four TI DSPs on an advanced mezzanine card (AMC), which simply plugs into a PC.

"As our customers embark upon the next generation of challenging base station designs, known to take up to two years to develop, they've encouraged wireless base station vendors to ensure availability of a robust inventory of devices that are interoperable," stated Bill Beane, senior product manager for the IDT Flow-control Management Division. "Our collaboration with TI addresses these issues, and the resulting development platform conclusively demonstrates that the IDT PPS and the TI DSPs interoperate as required in a real system, while its software tools allow our customers to reduce their design development times."

"Next generation cellular standards demand DSP-intensive base stations capable of delivering the high bandwidth required for advanced wireless services, such as mobile video, at a competitive price," said John Smrstik, marketing manager for the Texas Instruments Communications Infrastructure and Voice Group. "IDT's pre-processing switch enables OEMs to gain the most efficient use of our DSPs' processing power."

The Development Platform

The AMC70K2000 development platform -- jointly created by IDT and TI -- offers a diverse mix of hardware options and software tailored for baseband processing demonstrations and development. The offering includes an AMC and all of the software necessary for rapid setup, initialization, and on-site evaluation of the PPS capabilities. The platform enables realistic case studies for moving tasks and operations from the DSPs to the PPS and observing the system responses. The AMC deploys four fabric-connected TI DSPs (TMS320C6455/6482) and the IDT PPS (70K2000) offering a RapidIO interface of 40 lanes and 22 ports; accelerating each DSP in a cluster by up to 20 percent. It has a three Gigabit Ethernet backplane, one line I/O; DRAM DDR2 up to 128 Mbytes per DSP; flash storage (serial high speed) and I2C; JTAG for system boot master, MMC; MMC control for IPMI with additional applications; and a local-power option for stand-alone operation. A built-in expansion port offers the ready addition of a daughter card supporting other Serial RapidIO endpoints, including the new IDT 10G serial buffer.