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Qualcomm Announces Production Shipment of World's First radioOne
1X Chipset
October 30, 2002
Qualcomm Incorporated today announced the on-time production shipment
of the MSM6050 Mobile Station Modem (MSM) chipset and system software
for 3G CDMA2000 1X mobile devices. Production quantities began shipping
in September 2002, and initial handsets based on the MSM6050 solution
are expected early in calendar 2003.
The MSM6050 chipset solution, which features Qualcomm‚s radioOne
Zero Intermediate Frequency (ZIF) technology, consists of the RFT6100,
RFR6000 and RFL6000 transmit and receive chips, PM6050 power management
chip, DMSS6050 software and the accompanying Subscriber Unit Reference
(SURF) development platform.
"We are very excited with the broad adoption of our radioOne solutions
for 3G CDMA2000 1X and with more than 13 customers designing handsets
using our MSM6050 chipset, we expect to see MSM6050-based terminals
with new multimedia and position-location applications in the marketplace
shortly," said Don Schrock, president of Qualcomm CDMA Technologies.
"By delivering increased performance at lower system costs, the
MSM6050 chipset and system software will accelerate the rapid deployment
and success of 3G CDMA2000 1X systems throughout the world."
Qualcomm‚s radioOne ZIF architecture eliminates the need for all
IF components Integrated Circuits (ICs), Surface Acoustic Wave (SAW)
filters and Voltage-Controlled Oscillators (VCOs) thereby reducing
printed-circuit-board area and bill-of-material (BOM) costs. In
addition, only one external ultrahigh frequency (UHF) single-band
VCO is required for all CDMA frequency bands worldwide. Both UHF
receive and transmit phase locked loops (PLLs), as well as the transmit
VCO, are integrated on-chip. Phones and other wireless devices designed
with the radioOne chipset also benefit from the elimination of complex
matching of RF components.
The radioOne MSM6050 chipset is designed to deliver increased system
processing power and to support the enhanced memory interfaces required
by application-rich 3G terminals. With the introduction of new generations
of cost-effective, high-density memory technologies for the mobile
industry, the MSM6050 solution supports optimized interfaces to
page-mode NOR flash for modem processing, NAND flash for applications
data storage and low-cost static RAM (SRAM). This flexibility enables
terminals with higher memory density and increased processor performance
to be designed at lower system cost.
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3G Motorola A920
