3GNewsroom.com Home
3G shop
you are here: Home >> 3G News

  Recent News

Qualcomm and Teleepoch Enter Into a 3G CDMA Subscriber Unit License Agreement, October 6, 2007

MTN chooses Cambridge Broadband Networks for multi-service wireless network in Rwanda, October 6, 2007

Brazilian government to publish 3G bidding rules soon, October 6, 2007

KTF 3G service suffers from technical problems, October 6, 2007

Argentina’s Personal lunches 3G service in Rosario, October 6, 2007

Russia has it's first 3G network, October 6, 2007

AT&T could drop Alcatel-Lucent as 3G mobile network supplier, October 6, 2007

Enea Extends License Agreement with ZTE for 3G Handsets, October 2, 2007

LG to unveil premium handsets in Brazil, October 2, 2007

KTF 3G subscribers doubled in less than 3 months, October 2, 2007

3G policy in India will be non-uniform, October 2, 2007

- previous news

Search
Search news
Search this site
 


InterDigital announces advanced HSDPA coprocessor ASIC

October 10, 2005

InterDigital Communications Corporation announced the availability of its UMTS Release 5 HSDPA (High Speed Downlink Packet Access) coprocessor terminal unit ASIC (Application Specific Integrated Circuit) in accordance with its announced schedule. InterDigital's HSDPA technology, verified now in ASIC form, optimally supports all service categories up to Category 10 (14 Mbps) for incorporation into mobile terminal devices.

Fabricated using 130 nanometer technology and designed to be process independent, InterDigital's HSDPA coprocessor includes the following features:

-- Compliance with UMTS Release 5;
-- Low power consumption;
-- Low MIPS requirements;
-- Low-profile package (8 x 8mm with 132 pin Ball Grid Array);
-- Flexible design allows for customized OEM implementation;
-- Optimally supports all categories;
-- Design can be scaled to customer targeted categories;
-- Easy integration with existing UMTS Release 99/Release 4 implementations.
-- Supports transmit and receive diversity;
-- Already meets stricter UMTS Release 6 requirements;
-- Architecture scalable to Release 6 HSUPA (High Speed Uplink Packet Access).

InterDigital offers its standards-compliant HSDPA technology solution as a separate coprocessor which can be adapted to interface with any UMTS Release 99/Release 4 offering. InterDigital's solution can also be provided to a customer as technology blocks for incorporation into existing UMTS Release 99/Release 4 chips. InterDigital recently announced Philips Semiconductor, NV as its first HSDPA technology customer.

InterDigital's HSDPA coprocessor incorporates an advanced receiver (chip level equalizer) which is the key enabler in achieving high data rate performance and meeting the stricter performance levels for UMTS Release 6.

"At 3GSM World Congress earlier this year, we demonstrated our advanced receiver-based HSDPA solution in an FPGA form," said Mark Lemmo, Senior Business Development and Product Management Officer. "The implementation of HSDPA as a coprocessor validates our market leadership in the delivery of advanced 3G technologies. Our mature, scalable HSDPA solution complements our UMTS Release 99/Release 5 protocol software solution and provides a migration path to HSUPA."

 

Cheap International calls


www.3GNewsroom.com, 2001 - 2007, disclaimer, contact us