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TI unveils most integrated diversity processor

October 20, 2005

Texas Instruments (TI) introduced the industry's most integrated, highest performance diversity mixed signal receive processor for 3G base stations and fixed wireless communication devices. TI's AFE8406 multi-carrier chip integrates a dual 14 bit 85 MSPS (Mega Samples Per Second) analog-to-digital converter (ADC) and sixteen channels of programmable digital down conversion (DDC) into a single device.

Leveraging TI's high performance, advanced technology, this multi-channel communication signal processor offers increased density, resulting in lower costs for systems supporting a range of 3G standards. The multiple DDC channels allow a larger number of carriers per signal chain, translating to significantly reduced implementation costs. TI's AFE8406 can be configured to support up to four-carrier UMTS, eight-carrier CDMA or eight-carrier TD-SCDMA diversity receivers.

"The release of the 3G spectrum in China will create a large demand for advanced wireless infrastructure applications, providing the next-level of mobile telecommunications services and features to the world's largest cellular market," said David Briggs, TI's analog wireless infrastructure business manager. "TI has responded to the wireless infrastructure designers' needs for enhanced integration, higher performance and increased density for 3G applications with its new AFE8406."

TI's AFE8406 delivers outstanding intermediate frequency (IF) performance with extremely low noise to enable multi carrier operations. At an input frequency of 140 MHz, the device delivers signal-to-noise ratio (SNR) of greater than 68 dB, and spurious free dynamic range (SFDR) of greater than 70 dBc.

For developers using the AFE8406, TI provides an evaluation module (EVM) for easy integration of the device into wireless infrastructure base stations and other targeted applications. The EVM is complemented with the easy to use GC Studio software for data analysis.

The AFE8406 is available in a 484-pin 23 mm x 23 mm ball grid array (BGA) package. Samples are available now with projected production in 1Q 2006.

 

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