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Philips Strengthens Strategic Partnership With Ericsson Mobile Platforms
September 4, 2002
Philips Electronics and Ericsson Mobile Platforms today signed
an agreement which reinforces their strategic partnership in the
development of leading 2.5 and 3G mobile handset technologies, using
Philips' advanced semiconductor capabilities.
Under the terms of the agreement Philips will source semiconductor
devices for Ericsson reference designs. Philips will make its latest
semiconductor technologies available for Ericsson reference designs.
The co-operation will give Ericsson access to Philips' vast semiconductor
product and technology portfolio including RF ASICs, baseband ASICs,
Power Amplifiers (PA) and Power Management Units (PMU).
The co-operation between the two companies will drive the development
of next generation mobile handsets, enabling multimedia and image
transition applications for end-users.
Tord Wingren, president of Ericsson Mobile Platforms, said, "The
company's leading position in the communications market, combined
with its low-cost, high-performance RF process technology, will
enable Ericsson Mobile Platforms to realize its goal to support
all major next-generation wireless standards including GSM/GPRS,
EDGE and WCDMA. Increasing our co-operation will help us focus on
a limited number of key partners."
Mario Rivas, executive vice president communications businesses
Philips Semiconductors, says, "In addition to our RF expertise we
are able to offer Ericsson the latest baseband and wireless technologies,
and as the partnership develops, access to the complete range of
Philips' semiconductor expertise needed to build state-of-the-art
2.5 and 3G handsets."
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3G Motorola A920
