Qualcomm and Teleepoch
Enter Into a 3G CDMA Subscriber Unit License Agreement, October
6, 2007
MTN chooses Cambridge Broadband
Networks for multi-service wireless network in Rwanda, October 6,
2007
Brazilian government to
publish 3G bidding rules soon, October 6, 2007
KTF 3G service suffers
from technical problems, October 6, 2007
Argentina’s Personal
lunches 3G service in Rosario, October 6, 2007
Russia has it's first 3G
network, October 6, 2007
AT&T could drop Alcatel-Lucent
as 3G mobile network supplier, October 6, 2007
Enea Extends License Agreement
with ZTE for 3G Handsets, October 2, 2007
LG to unveil premium handsets
in Brazil, October 2, 2007
KTF 3G subscribers doubled
in less than 3 months, October 2, 2007
3G policy in India will
be non-uniform, October 2, 2007
- previous news
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InterDigital FDD protocol stack technology selected by Infineon-Huawei
WCDMA Mobile Phone Platform
September 20, 2003
InterDigital Communications, an architect, designer and provider of wireless
technology and product platforms, announced that its Frequency Division
Duplex (FDD) protocol stack technology, a component of InterDigital's
complete WCDMA solution, will be utilized by Infineon in solutions to
be provided to Huawei under their recently announced partnership.
Under its joint development relationship with Infineon, begun in March
2001, InterDigital provides portions of Infineon's FDD protocol stack
for wireless terminal devices. In accordance with that agreement, InterDigital
would receive royalties on a per unit basis for baseband components sold
by Infineon to Huawei that include the jointly developed FDD protocol
stack.
"We congratulate Infineon and Huawei on their recent announcement," said
Howard Goldberg, President and Chief Executive Officer. "We look forward
to contributing to their success, as well as the overall success of 3G
wireless in China. The use of our FDD protocol stack technology, jointly
developed with Infineon, is evidence that we are delivering competitive
solutions to the 3G wireless market."
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