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Sierra Wireless supports Intel UMPC platform with 3G embedded modules
September 28, 2006
Sierra Wireless announced support for Intel Corporation's 3G-enabled Ultra Mobile PC platform, shown at the Intel Developer Forum in San Francisco. Sierra Wireless collaborated with Intel to incorporate Sierra Wireless WWAN modules into the UMPC platform architecture, which is designed to provide integrated wireless 3G connections for ultra-mobile devices (typically defined as small form-factor Tablet PCs). With wide area wireless embedded modules from Sierra Wireless integrated into the UMPC platform, original equipment manufacturers (OEMs) and original design manufacturers (ODMs) can take advantage of proven, reliable 3G connectivity solutions to simplify product development and expedite time-to-market.
"Sierra Wireless is pleased to collaborate with Intel to provide seamless 3G-enabled connectivity options for the UMPC platform," said Trent Punnett, Senior Vice President, Marketing and Corporate Development for Sierra Wireless. "Bringing high-quality 3G connections to Ultra Mobile PC devices allows for true on-the-go applications. We believe this will lead to the development of many innovative mobile devices, and we look forward to working with our OEM customers to bring these leading edge products to market."
OEM and ODM customers utilizing the UMPC platform can choose from the full lineup of Sierra Wireless PCI Express Mini Card embedded modules to provide voice and high-speed data access to 3G networks worldwide. Sierra Wireless has over 12 years' experience delivering wireless wide area network connectivity in a wide variety of computing devices and form factors. In addition to providing the modules, Sierra Wireless offers professional services to OEM and ODM customers integrating Sierra Wireless products, to assist with optimization of the module and antenna performance, device testing, and network certification.
Sierra Wireless PCI Express Mini Card modules include a common comprehensive WHQL-certified USB software driver architecture that provides superior power management, a dedicated diagnostic channel and the ability to enable or disable NDIS or DUN support, which provides maximum flexibility to OEM customers when designing their wireless product. Each module is PCI Express Mini Card form factor compliant, fully shielded and offers an operating temperature range of -30 to +60 degrees Celsius to suit all applications. Each module measures 51 x 30 x 4.5 mm, weighs in at less than 12 g, and complies with new European Union directives on RoHS (Restrictions on Hazardous Substances).
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